Mobile Phone BGA Rework Station with CCD Optical Alignment High Precision

The Mobile Phone BGA (Ball Grid Array) Rework Station is a high-performance, professional-grade repair solution designed specifically for advanced smartphone maintenance and PCB rework. Engineered to meet the rigorous demands of modern electronics repair, this station combines intelligent temperature control, high-definition optical alignment, and automated precision mechanics. Whether handling micro-BGA chips, CPU replacements, or complex motherboard repairs, this equipment ensures exceptional reliability, minimal thermal damage, and maximum operational efficiency.

• 5 work modes for versatile operation
• 15" HD LCD monitor for clear visual feedback
• 7" HD color touch screen for intuitive control
• Stepping motor for precise movement control
• CCD color optical alignment system for accurate positioning
• Temperature accuracy within ±1℃
• Mounting precision within ±0.01mm
• Repair success rate: 99%+
• Independent research and development of single-chip control

High definition and adjustable CCD color optical alignment system with beam split, amplification, lessening, fine adjustment and auto focus capabilities. Features automatic color aberration resolution and brightness adjustment, adjustable image contrast. Equipped with 15" high definition LCD monitor for optical alignment system BGA rework station.

Adopting HD touch human-machine interface with upper heating head and mounting head designed as 2-in-1 unit. Provides multiple titanium alloy BGA tuyere options that rotate 360 degrees for easy installation and replacement. X, Y and R angle adopted micrometer fine-tuning for accuracy locating with precision reaching ±0.01mm.

Includes alarm function that automatically signals after BGA welding completion. Features double over-temperature protection with automatic circuit power-off in case of temperature abuse. Temperature parameters include password protection to prevent unauthorized modifications.

This Mobile Phone BGA Rework Station is widely applicable to all kinds of mobile phone motherboard chip maintenance, including CPU, flash memory, power chip and other precision BGA chip disassembly, welding and reballing. It is also suitable for precision rework of small and medium sized electronic components, and can meet the processing needs of electronic repair stores, factory after sales maintenance, laboratory precision research and development and other scenarios.

By integrating cutting-edge optical vision systems with robust thermal management, our Mobile Phone BGA Rework Station significantly reduces manual error and boosts repair success rates. Its user-friendly smart interface allows both novice technicians and seasoned professionals to achieve factory-level precision. Backed by strict ISO quality certifications and comprehensive after-sales support, this equipment represents a reliable, long-term investment for any electronics maintenance operation.